Samsung Introduces First 30nm DDR3 Memory

After the end of last month's notice concerned has started to be mass produced 32GB memory modules based on 30nm fabrication node, Samsung is now reportedly preparing to launch its first consumer memory solutions that utilize the sophistication of 30nm DDR3 DRAM chips.

Range of memory that Samsung is preparing is going to involve very low profile (VLP) UDIMM for desktop and SO-DIMMs for notebooks. And this will be available both as a DDR3 module itself with 2GB and 4GB capacity, or in kit form to provide a 4GB or 8GB memory upgrade for users of DIY.


Its clock speed will be set at 1600MHz, but unfortunately not known about the timing information available at this time.

According to Samsung, this new 30nm memory chips use up to 2 / 3 of energy produced than the memory chips with 60nm technology the industry standard.

"Replacing DRAM you can become a thing of the easiest and most cost effective way to improve your PC performance, and new products offer the most energy-efficient options that are currently available to consumers," said Reid Sullivan, senior vice president of marketing of mobile entertainment at Samsung Electronics America.

"Samsung is committed to bringing enhanced performance computing for consumers, and 30nm process technology We offer an exceptional combination of advanced low-power DDR3 technology, with super-speeds up to 1600 megabits per second (Mbps)", explained the Samsung.

Latest 30nm DDR3 DRAM modules made ​​by Samsung will be available in the United States through a variety of online and retail suppliers, including Amazon, Fry's, Micro Center, NewEgg and TigerDirect.

Price for single module pack is expected to range from 30 USD (350 thousand dollars) to 55 USD (470 thousand dollars), while the dual-pack module will range from 55 USD (470 thousand dollars) to 110 USD (940 thousand dollars).